High Frequency Circuit Materials (Woven glass reinforced, ceramic filled thermoset)
- Nom de la marqueCIRCUIT
RO4450B™ and RO4450F prepregs were developed to enable users to build high frequency multilayers and are based upon the RO4000 series core materials. RO4450B and RO4450F prepregs are compatible in multilayer constructions with either RO4003C™, or RO4350B™ laminates. RO4000 series high frequency prepregs are compatible with the majority of standard FR4 processing practices. Prepreg technical information is provided in the RO4400 data sheet and fabrication guidelines below.
RO4500™and RO4730™ LoPro™ antenna grade laminates extend the RO4000 product series into large volume antenna applications. The ceramic filled, glass reinforced, hydrocarbon based material provides the controlled dielectric constant, low loss performance and excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications. Contact us at 480-961-1382 for more information and sampling of these new products.
LoPro™ Reverse-Treated Copper Foil Option is now available for RO4000® series laminates! This special interface technology works with RO4000 materials for improved insertion loss and outstanding passive intermodulation characteristics.